THE STUDY HOW TO ASSEMBLING SMD DEVICE INTEGRATED

Kunto Wibowo
Gunadarma University
Indonesia

Article Submitted: 18 November 2009

Article Published: 18 November 2009

Abstract

Nowadays, the size of electronic components is not macro anymore, but already in micro size, even nano. In designing electronic device using surface mount device (SMD), a number of special components which has better characteristics is oftentimes required because of the demand which can not be tolerated. Hermetic SMD (airproof SMD) is a preference to fulfill the demand for design of small size, light weight, perfect thermal performance, free of switching waves, and also higher circuit efficiency.

Keyword(s): assembling, SMD, thermal performance, effcient.

Subject Description : B.7.Integrated Circuit | B.7.1. Types and Design Styles | Advanced Technologies

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